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Incorporation of Si and Zr into Pure HfO₂ and Its Effects on Dielectric Integrity.

Hafnium-silicate (HfSiO4, (HfO2)x(SiO2)1-x) and hafnium-zirconate (HfZrO4, (HfO2)x(ZrO2)1-x) films were employed as a gate dielectric to enhance the electrical properties of pure HfO2. (HfO2)x(SiO2)1-x and (HfO2)x(ZrO2)1-x films were formed onto p-Si substrates with varying degrees of Hf content x (x = 1, 0.9, 0.7, and 0.5) via solution processing. With regard to (HfO2)x(SiO2)1-x, the leakage current decreased from 1.94 × 10-8 to 4.29 × 10-9 A/cm2 at a gate voltage of VG = -1 V when the HfO2 content was reduced. These resulted from the reduction of leakage paths through the interface between HfSiO4 and Si substrate. Additionally, (HfO2)x(ZrO2)1-x exhibited the lowest interfacial trap density of 3.4 × 1011 cm-2 eV-1 for x = 0.5 due to a reduction in root mean square (RMS) roughness of the film from 6.0 to 4.2 nm. From the results, it was found that (HfO2)0.5(SiO2)0.5 demonstrated excellent oxide integrity in contact with Si substrates, whereas (HfO2)0.5(ZrO2)0.5 demonstrated an enhanced film morphology and maintained a high dielectric constant value. Finally, the HfZrO4/HfSiO4/Si structure revealed a gate oxide with enhanced integrity compared to pure HfO2-based devices.

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