Add like
Add dislike
Add to saved papers

Material interface detection based on secondary electron images for focused ion beam machining.

Ultramicroscopy 2018 January
A method for interface detection is proposed for focused ion beam (FIB) processes of multilayered targets. As multilayers have emerged as promising structures for nanodevices, the FIB machining of multilayers has become a challenging issue. We proposed material interface detection by monitoring secondary electron (SE) images captured during the FIB process. The average of the gray-levels and the skewness coefficient of gray-level histograms of the SE images were evaluated to recognize endpoints for the FIB processes. The FIB process control with the proposed method was demonstrated by fabricating the nanostructures on the multilayered target without thickness information. It was also demonstrated on a curved surface. Grooves with a desired depth into the target and an aperture as an opening window were precisely fabricated by the FIB process control. The proposed strategy of the FIB process can be used for complex substrates such as curved or flexible targets.

Full text links

We have located links that may give you full text access.
Can't access the paper?
Try logging in through your university/institutional subscription. For a smoother one-click institutional access experience, please use our mobile app.

For the best experience, use the Read mobile app

Mobile app image

Get seemless 1-tap access through your institution/university

For the best experience, use the Read mobile app

All material on this website is protected by copyright, Copyright © 1994-2024 by WebMD LLC.
This website also contains material copyrighted by 3rd parties.

By using this service, you agree to our terms of use and privacy policy.

Your Privacy Choices Toggle icon

You can now claim free CME credits for this literature searchClaim now

Get seemless 1-tap access through your institution/university

For the best experience, use the Read mobile app