Rapid reagent-less on-line H 2 O 2 quantification in alkaline semiconductor etching solution.

A simple, rapid, and reagent-less calorimetric method for H2 O2 quantification, applicable automatically on-line was developed, analytically characterized and tested with real SC-1 alkaline etching solutions used in the semiconductor technology. Being based on H2 O2 catalytic decomposition by immobilized solid catalyst, the proposed method possesses excellent specificity toward the H2 O2 without any interference. The total quantification time was found to be less than 60s, RSD lies in the range from 4.7% to 1.8% for the linear concentration range from 2.8 10-2 to 2molL-1 respectively and the LOD was determined to be as low as 9.3 10-3 molL-1 .