Thermal Characterization of Dynamic Silicon Cantilever Array Sensors by Digital Holographic Microscopy.

In this paper, we apply a digital holographic microscope (DHM) in conjunction with stroboscopic acquisition synchronization. Here, the temperature-dependent decrease of the first resonance frequency ( S ₁( T )) and Young's elastic modulus ( E ₁( T )) of silicon micromechanical cantilever sensors (MCSs) are measured. To perform these measurements, the MCSs are uniformly heated from T ₀ = 298 K to T = 450 K while being externally actuated with a piezo-actuator in a certain frequency range close to their first resonance frequencies. At each temperature, the DHM records the time-sequence of the 3D topographies for the given frequency range. Such holographic data allow for the extracting of the out-of-plane vibrations at any relevant area of the MCSs. Next, the Bode and Nyquist diagrams are used to determine the resonant frequencies with a precision of 0.1 Hz. Our results show that the decrease of resonance frequency is a direct consequence of the reduction of the silicon elastic modulus upon heating. The measured temperature dependence of the Young's modulus is in very good accordance with the previously-reported values, validating the reliability and applicability of this method for micromechanical sensing applications.