Cunkai Zhou, Ye Tian, Gen Li, Yifei Ye, Lusha Gao, Jiazhi Li, Ziwei Liu, Haoyang Su, Yunxiao Lu, Meng Li, Zhitao Zhou, Xiaoling Wei, Lunming Qin, Tiger H Tao, Liuyang Sun
In implantable electrophysiological recording systems, the headstage typically comprises neural probes that interface with brain tissue and integrated circuit chips for signal processing. While advancements in MEMS and CMOS technology have significantly improved these components, their interconnection still relies on conventional printed circuit boards and sophisticated adapters. This conventional approach adds considerable weight and volume to the package, especially for high channel count systems. To address this issue, we developed a through-polymer via (TPV) method inspired by the through-silicon via (TSV) technique in advanced three-dimensional packaging...
2024: Microsystems & Nanoengineering