Seunghyeok Lee, Gwang Min Park, Younghoon Kim, So-Hyeon Lee, Sung-Jin Jung, Junpyo Hong, Sung-Chul Kim, Sung Ok Won, Albert S Lee, Yoon Jang Chung, Ju-Young Kim, Heesuk Kim, Seung-Hyub Baek, Jin-Sang Kim, Tae Joo Park, Seong Keun Kim
Porous thermoelectric materials offer exciting prospects for improving the thermoelectric performance by significantly reducing the thermal conductivity. Nevertheless, porous structures are affected by issues, including restricted enhancements in performance attributed to decreased electronic conductivity and degraded mechanical strength. This study introduces an innovative strategy for overcoming these challenges using porous Bi0.4 Sb1.6 Te3 (BST) by combining porous structuring and interface engineering via atomic layer deposition (ALD)...
March 26, 2024: ACS Applied Materials & Interfaces